OTHERS ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR TENDER PERKHIDMATAN PENYELENGGARAAN DAN SOKONGAN TEKNIKAL BAGI INFRASTRUKTUR ICT SERTA SISTEM INFORMASI KENDERAAN DAN PEMANDU (mySIKAP) DIPUSAT DATA DAN SEMUA PEJABAT JABATAN PENGANGKUTAN JALAN MALAYSIA.
| HEITECH PADU BERHAD |
| Type | Announcement |
| Subject | OTHERS |
| Description | ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR TENDER PERKHIDMATAN PENYELENGGARAAN DAN SOKONGAN TEKNIKAL BAGI INFRASTRUKTUR ICT SERTA SISTEM INFORMASI KENDERAAN DAN PEMANDU (mySIKAP) DIPUSAT DATA DAN SEMUA PEJABAT JABATAN PENGANGKUTAN JALAN MALAYSIA. |
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HeiTech Padu Berhad (“HeiTech” or “the Company”) is pleased to announce that the Company had on 15th April 2024 accepted and signed the LOA from Road Transport Department Malaysia (“JPJ”) for Tender Perkhidmatan Penyelenggaraan dan Sokongan Teknikal bagi Infrastruktur ICT serta Sistem Informasi Kenderaan dan Pemandu (MySIKAP) dipusat Data dan semua pejabat JPJ. (“Contract”).
Please refer to the attached file for details of the announcement.
This announcement is dated 15th April 2024. |
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Please refer attachment below.
Announcement Info
| Company Name | HEITECH PADU BERHAD |
| Stock Name | HTPADU |
| Date Announced | 15 Apr 2024 |
| Category | General Announcement for PLC |
| Reference Number | GA1-15042024-00040 |