HTPADU

2.030

-0.07 (-3.3%)

Change in Boardroom

HEITECH PADU BERHAD

Date of change 03 Apr 2024
Name PUANĀ SALMI NADIA BINTI MOHD HILMEY
Age 42
Gender Female
Nationality Malaysia
Designation Group Managing Director
Directorate Executive
Type of change Appointment

Qualifications

No
Qualifications
Major/Field of Study
Institute/University
Additional Information
Masters
Masters of Science (MsC) in Management and Information System
University of Nottingham, United Kingdom
Degree
Bachelor of Arts (B.A), Finance, Accounting and Management
Nottingham Trent University, United Kingdom

Working experience and occupation
Puan Salmi Nadia Binti Mohd Hilmey joined HeiTech in 2007. She was appointed as the Special Assistant to the GCEO in 2011 and later as Director of Corporate Development and Risk Management in 2014. Within these years, she has been responsible for all centralised functions under Corporate Services, while overseeing the operations and performance of all companies within HeiTech group.

In January 2016, she was appointed as Executive Vice President, Risk Management and Corporate Services. Subsequently, Puan Salmi Nadia was appointed as the Head of Core 2, to lead more than ten (10) subsidiary companies in HeiTech Group in September 2018. She assumed the role of Group Chief Operating Officer on April 2021, before being appointed as the Group Chief Executive Officer of the Company on 2 October 2023, thereby taking on broader responsibilities within the Company.
Directorships in public companies and listed issuers (if any)
Nil
Family relationship with any director and/or major shareholder of the listed issuer
She is the daughter of Dato' Sri Mohd Hilmey Bin Mohd Taib, the Executive Deputy Chairman.
Any conflict of interests that he/she has with the listed issuer
Nil
Details of any interest in the securities of the listed issuer or its subsidiaries
Direct Interest - 1,000 Ordinary Shares



Remarks :
Puan Salmi Nadia Binti Mohd Hilmey shall be the Group Managing Director / Group Chief Executive Officer of HeiTech Padu Berhad effective from 3rd April 2024.


Announcement Info

Company Name HEITECH PADU BERHAD
Stock Name HTPADU
Date Announced 03 Apr 2024
Category Change in Boardroom
Reference Number C03-03042024-00007