NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING SEDANIA INNOVATOR BERHAD ("SIB" OR THE "COMPANY") PRIVATE PLACEMENT OF UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF SIB ("PRIVATE PLACEMENT")
| SEDANIA INNOVATOR BERHAD |
| Type | Announcement |
| Subject | NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) FUND RAISING |
| Description | SEDANIA INNOVATOR BERHAD ("SIB" OR THE "COMPANY")
PRIVATE PLACEMENT OF UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF SIB ("PRIVATE PLACEMENT") |
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The terms used herein, unless the context otherwise stated, bear the same meaning as those defined in the earlier announcement in relation to the Private Placement. We refer to the earlier announcements dated 20 July 2023, 21 July 2023, 1 August 2023 and 3 August 2023 in relation to the Private Placement. On behalf of the Board, UOBKH wishes to announce that the Board had on 25 October 2023 resolved to fix the issue price for the Private Placement at RM0.1545 per Placement Share. The issue price of RM0.1545 per Placement Share represents a discount of approximately 9.97% to the 5-day VWAP of SIB Shares up to and including 24 October 2023, being the last traded day of SIB Shares immediately preceding the price-fixing date, of RM0.1716 per SIB Share.
This announcement is dated 25 October 2023. |
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Announcement Info
| Company Name | SEDANIA INNOVATOR BERHAD |
| Stock Name | SEDANIA |
| Date Announced | 25 Oct 2023 |
| Category | General Announcement for PLC |
| Reference Number | GA1-25102023-00051 |