Telekom Malaysia Berhad (TM) refers to its previous announcements dated 7 July 2022 and 30 January 2023 wherein it was announced that TM has received an Award on liability dated 6 July 2022 from the Singapore International Arbitration Centre (SIAC), and thereafter on 27 January 2023, the High Court of Singapore has dismissed the Originating Application filed by Vodoke Pte Ltd (VPL) seeking a relief to set aside the aforesaid Award on liability.

TM wishes to announce that it has on 6 February 2023, received the Final Award on Damages and Costs dated 3 February 2023 from SIAC, as follows:

1. VPL is to pay TM damages and loss in the sum of USD3,086,383.98;

2. VPL is to pay TM interest on the said sum of USD3,086,383.98 awarded on damages at the rate of 5.33% per annum from the date of the Final Award until full settlement by VPL of the said sum;

3. VPL is to bear the costs of the arbitration of SGD318,209.11;

4. VPL is to pay TM the following legal and other costs:

(i) The sums of RM1,074,190.15 and S$339,785.18 as legal representation costs of TM;

(ii) S$2,000.00 as SIAC Filing Fees;

(iii) S$23,717.00 as Costs of Transcription Services incurred.

5. The amounts payable by VPL under items 3, 4, and 5 in this Final Award are to be paid by VPL to TM within 45 days of the date of this Final Award, failing which, VPL shall further pay interest at the rate of 5.33% per annum on such unpaid amounts thereto from the date of the expiry of the said 45 days until full settlement by VPL on all or such balance of the said amounts payable by VPL to TM.

TM shall make further announcement if there are any material developments in respect of this matter.

This announcement is dated 7 February 2023.