Gabriel Khoo

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Rare value investors in Malaysia. The real value investors will only build wealth not losing wealth

Joined Dec 2017

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twofold in 2026, reaching 50.7 million units. The top three vendors, in order, are Broadcom, Lumentum, and Sumitomo Electric, with a combined market share of 55%.
6 hours · translate
TrendForce's latest research indicates that, with the expansion of Al data center scales and the arms race in computing power, transmission rates have risen above 1.6 Tbps. NVIDIA, Google, Meta, and other vendors, to ensure a stable supply, are strategically locking in production capacity from EML and CW-DFB LD chip suppliers, driving suppliers to actively expand production in response to customer demand. This will further boost total EML and CW-DFB LD production capacity by more than twofold in
6 hours · translate
Customer L – incremental upside, RFQ pending. A secondary driver for datacom photonics could come from Customer L, which is scaling its optical transceiver output via regional contract manufacturing partners. If secured, our understanding is that Inari would handle wafer processing and die attach/wirebond, with module-level assembly sitting with another local EMS partner. The program is currently under RFQ; production ramp could begin by end-2026 if awarded.
23 hours · translate
Disclosure from Customer B remains limited, but industry checks point to a significant expansion of InP wafer capacity (by 4-6x) at its existing US site and also a new fab in Singapore. We view this as consistent with Inari’s guidance of doubling its existing capacity for the datacom photonics segment annually over FY27 and FY28
23 hours · translate
This transition is driving strong demand for high-power EML laser chips, where supply remains highly concentrated among Customer B, Lumentum, Coherent, and Sumitomo Electric. Despite ongoing aggressive capacity expansion across these key suppliers, demand is still severely outstripping supply, with shortages expected to persist beyond 2027.
23 hours · translate
The structural shift driving demand is the ongoing displacement of copper interconnects by optical solutions across AI DC, as the industry pushes toward higher 800G and 1.6T speeds. Today, scale-out connectivity (inter-rack) is already predominantly optical, while scale-up (intra-rack, GPU board-level) — the much larger volume opportunity — is only beginning to transition.
23 hours · translate
HL: Datacom photonics – in a structural upcycle. The primary growth driver within this segment is Customer B's optical components division, which outsources processed indium phosphide (InP) wafers to Inari for further back-end processing and chip-on-carrier assembly into optical laser chips (EML and CW). Inari has served Customer B in this capacity since 2015.
23 hours · translate
if you refer to inari Apr and May briefing key notes. you should be able to know
23 hours · translate
connectivity is new bottleneck for AI. Optical players like avago marvel lumentum coherent are all time high again
23 hours · translate
wow. computex...tmr inari turn
Yesterday · translate
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