Our website is made possible by displaying non-intrusive online advertisements to our visitors.
Please consider supporting us by disabling or pausing your ad blocker.
Function: Focuses on lower-margin, legacy optoelectronics, standard sensors, and generic IC (Integrated Circuit) packaging and assembly.
Status: This is the facility that experienced the localized fire on May 10, 2026, which temporarily halted its operations and damaged about 10% of its floor space.
CK2:
Function: Handles standard optoelectronics and traditional-speed fiber-optic module packaging. It deals with established technology rather than bleeding-edge data center transceivers.
Status: Located adjacent to CK1, but completely unaffected by the fire and operating normally.
The Malaysia Plants (The Core & Growth Engines)
Located in Penang (Bayan Lepas and Batu Kawan), these represent the high-margin backbone of the company.
P13 (Bayan Lepas):
Function: The massive, core hub for Inari's flagship Radio Frequency (RF) testing and advanced System in Package (SiP) assembly. This plant handles the high-volume, critical RF components used by major global smartphone manufacturers. It is the primary driver of the company's current double-digit profit margins.
P34 (Batu Kawan):
Function: The launchpad for Inari's high-growth segments. P34 is scaling up the production of advanced, ultra-fast optical transceivers (like the 800G modules) heavily driven by the booming AI data center market, in partnership with Taiwan's PCL Technologies. It also houses additional RF SiP assembly lines to support high demand.
P55 (Batu Kawan):
Function: One of Inari's newest and largest mega-facilities in the Batu Kawan Industrial Park. P55 was built to significantly expand their overall Outsourced Semiconductor Assembly and Test (OSAT) footprint, specifically catering to complex, next-generation packaging, automotive components, and the overflow of high-speed datacom/AI transceiver demands.
