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Samsung Electro-Mechanics wins $993 mil AI chip part deal in US
Published May 20, 2026 3:59 PM KST
Samsung Electro-Mechanics said Wednesday it has signed a 1.5 trillion-won ($993 million) deal to supply silicon capacitors, key components used in advanced semiconductor packages and chips, to a major technology company in the United States.
Intel Reported to Adopt Silicon Capacitors in 2027 to Improve EMIB Power Stability for Google’s v8e
Date: 28 May 2026
With TSMC’s CoWoS capacity remaining constrained, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging technology is increasingly gaining traction as an alternative, fueling expectations for stronger demand across related components.
Notably, ZDNet reports that Intel plans to begin mass adoption of silicon capacitors in 2027 to strengthen EMIB performance.
ZDNet notes that while EMIB is widely seen as a more cost-efficient advanced packaging solution, it is increasingly encountering limitations in providing stable power delivery for AI chips with rapidly rising power demands. To address this challenge, silicon capacitors and through-silicon vias (TSVs) are expected to be introduced for Google’s v8e, according to the report.
ZDNet further explains that a capacitor is a key circuit component that stores and releases electrical energy. Silicon capacitors, in particular, offer ultra-low equivalent series inductance (ESL) and equivalent series resistance (ESR)—reportedly more than 100 times lower than traditional multilayer ceramic capacitors (MLCCs)—helping significantly reduce signal loss in high-performance semiconductors.
Meanwhile, they are also built on a silicon wafer-based ultra-thin structure, enabling higher-density integration, the report suggests.
Citing an industry source, the report adds that voltage droop in high-frequency AI workloads is difficult to fully address with MLCCs alone, which is why Intel is increasingly turning to silicon capacitors as a potential solution.
The growing demand for silicon capacitors also aligns with Samsung Electro-Mechanics’ announcement on May 20. Chosun Biz, citing a press release, reported that the firm has secured a silicon capacitor supply deal worth roughly 1.557 trillion won (USD 993million) with a major global customer, covering the period from January next year (January 2027) through December 2028.
At a recent media seminar on the 14th, Samsung Electro-Mechanics said it is building a full-scale mass production system for silicon capacitors and expanding its push into the global AI semiconductor market. A silicon capacitor is a component used in AI semiconductor packaging.
Last month, Samsung Electro-Mechanics announced that it would begin supplying silicon capacitors to a global company from January next year. The contract is worth 1.5 trillion won.
As the AI semiconductor era gathers pace, the importance of silicon capacitors is rising quickly. The latest AI servers are packed with Graphics Processing Units (GPUs) and High Bandwidth Memory (HBM), which leads to massive instantaneous power consumption and frequent minor voltage fluctuations. If power supply is unstable, it can cause calculation errors or lower performance. Stable power delivery technology is therefore essential for silicon capacitors.
Silicon capacitors work in a similar way to MLCCs, but their structure, materials, manufacturing process, and applications are different. While MLCCs are strong at storing power by stacking ceramic materials in multiple layers, silicon capacitors are specialized in achieving an ultra-thin structure and excellent high-frequency characteristics by using semiconductor processes.
Their strengths are even more pronounced in AI semiconductors. Because they are made on silicon wafers, they can be made much thinner and mounted directly inside semiconductor packages. They also incur less power loss than MLCCs, allowing them to respond quickly to power fluctuations. They also effectively reduce signal interference generated during high-speed computing.
Samsung Electro-Mechanics' biggest strength is that it can provide an integrated solution rather than individual components. AI semiconductor packages use FC-BGA package substrates, MLCCs, and silicon capacitors together. Samsung Electro-Mechanics is one of the few companies that can supply all of them.
Kim Won-gi, head of the Silicon Capacitor Development Group at Samsung Electro-Mechanics, said, "The teams responsible for semiconductor substrates, MLCCs, and silicon capacitors operate as one team," adding, "We are proposing the optimal combination of components based on the voltage, capacitance, and substrate structure that customers want."
The application range for silicon capacitors is also expanding rapidly. They were initially used mainly in mobile devices, but demand has recently surged in AI data centers. Industry watchers expect their use to expand further in physical AI fields such as humanoid robots, self-driving cars, and industrial robots. As AI-based control becomes more common, ultra-fast computing and high reliability are becoming more important.
