真正让inari大跌的原因应该是这个pbb今天写的研究报告：

Planning capex for advanced packaging.

During our recent site visit to P13 plant, management guided that it has started venturing into advanced packaging platforms such as flip-chip chip-scale packages, flip-chip ball grid arrays and 2.5D/3D stacked packaging. We gather that the group is in close collaboration with its key technology partner and is poised to commercialise its new product in the coming months.
We understand that the cost of setting up 1 advanced