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On prospects, the group expects its growth momentum to continue through 2026, underpinned by the ongoing recovery in the global technology sector and rising demand linked to artificial intelligence, machine learning and high-performance computing.
The company also expects broader industrial digitalisation trends across manufacturing industries to support demand for its services.
“With semiconductor customers reporting renewed confidence and accelerating momentum, the group will continue leveraging its expanding competencies and capabilities to secure higher order volumes,” it said.
Global semiconductor technology company MKS Inc has opened its MKS Supercenter Factory in Penang, representing a strategic investment of over RM400 million.
Located on a 0.40-hectare site with approximately 350,000 sq ft of built-up space, the facility will support the growing global demand for wafer fabrication equipment.
Developed in multiple phases, the project’s first phase is now complete.
The results underscored unabated demand for artificial intelligence infrastructure, high-performance computing (HPC), and next-generation memory and logic architecture.
This presents a bright outlook for the Malaysian semiconductor-related industry, including 3REN Berhad.
This presents a bright outlook for the Malaysian semiconductor-related industry, including 3REN Berhad. As a specialized provider of automation solutions and engineering services, 3REN serves critical segments across the global semiconductor and electronics value chain, directly mirroring the operational momentum seen among major industry peers.
Beyond broader market tailwinds, 3REN stands out as a direct beneficiary of ongoing shifts in global supply chain architecture. As multinational chipmakers diversify their manufacturing footprints and double down on advanced packaging technologies, 3REN’s long-standing relationship with industry giant Intel Corporation serves as a powerful earnings multiplier. Intel’s aggressive deployment of proprietary advanced packaging solutions, most notably Foveros (3D stacking technology) and EMIB (Embedd
EMIB (Embedded Multi-die Interconnect Bridge 2.5D technology), is directly translating into higher order flows, expanded service engagements, and heightened earnings visibility for 3REN. Because advanced packaging requires high-precision automated handling, rigorous post-silicon validation, and continuous engineering optimization, 3REN’s specialized product engineering and assembly support services are deeply integrated into Intel’s operational workflow.
Big Tech Adoption: Hyperscalers and chip designers—including reported interest and design wins from Google, Amazon, and Nvidia—are actively evaluating or utilizing Intel's EMIB technology for specific AI processors and cost-sensitive ASICs to avoid TSMC's manufacturing queues. [1, 2]
