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只是这个消息而起。 NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING EP MANUFACTURING BHD ("EPMB" OR THE "COMPANY") PRIVATE PLACEMENT
EP MANUFACTURING BHD
Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description
EP MANUFACTURING BHD ("EPMB" OR THE "COMPANY") PRIVATE PLACEMENT
Reference is made to the Company’s announcements dated 7 May 2021, 20 May 2021 and 2 June 2021 in relation to the Private Placement (“Announcements”). Unless otherwise defined, capitalised terms used in this announcement shall have the same meanings as defined in the aforesaid Announcements.
On behalf of the Board, HLIB wishes to announce that the Board has fixed the issue price at RM0.465 per Placement Share for the Private Placement today. The issue price of RM0.465 per Placement Share represents a discount of approximately 9.8% to the 5-day VWAMP of the Shares up to and including 2 July 2021 of RM0.5154 per Share.
